Overview
Selective Laser-Induced Etching (SLE) is a two-step process enabling the fabrication of complex 3D microstructures inside transparent materials with exceptional surface quality and geometric freedom.
Physical Principle
Step 1: The femtosecond laser is focused inside the glass volume, causing localized structural modifications through multiphoton absorption. This creates regions of increased etch selectivity (up to 1000x faster etching). Step 2: Chemical etching (KOH or HF solution) selectively removes the laser-modified regions, leaving smooth channels with Ra < 50 nm.
Recommended CP-Series Models for This Process
Technical Capabilities
Compatible Materials
Fused Silica (SiO₂)
Highest etch selectivity, best optical quality
Borosilicate Glass (BK7, D263)
Cost-effective, good biocompatibility
Sapphire (Al₂O₃)
Extreme chemical resistance, high-temperature applications
Applications
Lab-on-Chip Devices
- •Integrated mixing chambers
- •Cell sorting networks
- •PCR microreactors
Microfluidic Sensors
- •Pressure sensors
- •Flow rate meters
- •Chemical gradient generators
Optical Microfluidics
- •Optofluidic waveguides
- •On-chip spectroscopy
- •Evanescent wave sensors
Biomedical Research
- •3D cell culture chambers
- •Organ-on-chip platforms
- •Drug screening arrays
Technology Comparison
| Parameter | SLE (Femtosecond) | Traditional Glass Etching | Micromilling |
|---|---|---|---|
| 3D Capability | True volumetric | 2D/2.5D only | 2.5D with tool access |
| Surface Roughness (Ra) | < 50 nm | 100-500 nm | 200-1000 nm |
| Minimum Feature Size | 10 μm | 50 μm | 100 μm |
| Design Freedom | Arbitrary 3D paths | Mask-defined | Tool-path limited |
| Throughput (complexity dependent) | Minutes to hours | Hours (multi-mask) | Hours (multi-step) |
Ready to Implement This Process?
Contact us to discuss rental options (from €5000/month), outright purchase, or to connect with our partner network for job shop processing and process development services (paid).